Development and production of thermoelectric modules
               
 
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According to RoHS directive requirements, serial thermoelectric coolers do not contain lead or any other forbidden materials

According to RoHS directive requirements, serial thermoelectric coolers do not contain lead or any other forbidden materials


Rectangular thermoelectric coolers with a hole

 

 

 

 

To notate thermoelectric coolers with a hole a system of notation of standard single-stage thermoelectric coolers with an index is used:

CH - for rectangular modules with a central hole (for example -43-1.0-0.8CH)

CHR - for round coolers with a central hole

(for example -19-1.0-1.3CHR)

R - for round coolers (for example TB-253-1.4-1.5R)

 
NameImax
(A)
Qmax
(W)
Umax
(V)
dTmax
(K)
R
(Ohm)
A
(mm)
B
(mm)
H
(mm)
D
(mm)
3.19.65.1691.2020.020.03.86.5
TB-41-1.0-0.8CH
5.718.65.3680.7022.517.53.19.5
TB-41-1.0-1.3CH
3.611.75.3691.1022.517.53.69.5
3.632.314.7693.1030.030.03.64.0
3.128.014.7693.4030.030.03.84.0
2.321.014.7694.9030.030.04.34.0
TB-41-1.4-1.1CH
8.225.15.0690.4523.023.03.69.5
6.151.013.7701.8040.040.04.013.0
7.972.014.7691.4040.040.03.47.8
6.156.014.9701.9040.040.03.97.8
3.735.115.3723.0040.040.04.87.8
7.975.015.5691.5040.040.03.44.7
6.159.015.7702.0040.040.03.94.7
3.736.816.0723.1040.040.04.84.7


STANDARD TERMS OF DELIVERY:

 

- substrate material - alumina (-96)

- height tolerance + 0,05 mm (L1)

- parallelism 0,03 mm (L1)

- wire length 120 mm

- pin orientation (for rectangular coolers) - to the longer side

- processing temperature up to 80, maximal assembly temperature 120 (assembly solder Tm = 139)

 

ADDITIONAL OPTIONS

Description

Notation (*)

Note

processing temperature up to 120 C, max assembly temperature = 130 C 

HT(120)

assembly solder with Tm = 139 C 
processing temperature up to 150 C, max assembly temperature = 170 C 

HT(150)

assembly solder Pb-Sn with Tm = 183 C 
processing temperature up to 200 C, max assembly temperature = 220 C 

HT(200)

assembly solder with Tm = 232 C
special version for operation under conditions of temperature cycling 

> 105 cycles +40C/+90 C
height tolerance = + 0.025 mm and parallelism 0.02 mm

L2

 
height tolerance = + 0.015 mm and parallelism 0.01 mm

L3

 
metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 C, 117 C, 139 C, 183 C)

mc95, mh95, mm117 etc.

 
gold plating

mcAu, mhAu, mmAu

metallization Cu-Ni-Au (0.2-1 micron)
substrate material - aluminium nitride (AlN)

N

heat conductivity > 180 W/mK
sealant: epoxy, silicon, urethane, conformal coating

E, S, U,

 
non-standard pin orientation  
type and length of wires by customer's requirement  
onnection to arraies   
onnectors crimping  
soldering on cold or hot heatsink, packaging or cold block  
(*)  the notations shown are used to notate additional options in cooler name

Examples:

1. FROST-72 HT (150)- thermoelectric cooler FROST-72, with max processing temperature = 150 , with substrate material of aluminium oxide.

2. DRIFT-0,8HT (200) mmAu N - thermoelectric cooler DRIFT-0,8 with max processing temperature = 200 , with substrate material of aluminium nitride. Cold and hot ends are metallized with golden coating.

 


  


 
 
 

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